±5ppm, I2C Real-Time Clock
3
Maxim Integrated
DS3231M
AC ELECTRICAL CHARACTERISTICS—POWER SWITCH
(TA = -45NC to +85NC, unless otherwise noted.) (Figure 2)
DC ELECTRICAL CHARACTERISTICS—GENERAL (continued)
(VCC = +2.3V to +5.5V, TA = -45NC to +85NC, unless otherwise noted. Typical values are at VCC = +3.3V, VBAT = +3.0V, and TA =
+25NC, unless otherwise noted.)
DC ELECTRICAL CHARACTERISTICS—VBAT CURRENT CONSUMPTION
(VCC = 0V, VBAT = +2.3V to +5.5V, TA = -45NC to +85NC, unless otherwise noted. Typical values are at VCC = 0V, VBAT = +3.0V,
and TA = +25NC, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power-Fail Voltage
VPF
2.45
2.575
2.70
V
Logic 0 Output
(32KHZ, INT/SQW, SDA)
VOL
IOL = 3mA
0.4
V
Logic 0 Output
(RST)
VOL
IOL = 1mA
0.4
V
Output Leakage
(32KHZ, INT/SQW, SDA)
ILO
-0.1
+0.1
A
Input Leakage
(SCL)
ILI
-0.1
+0.1
A
RST I/O Leakage
IOL
-200
+10
A
VBAT Leakage
IBATLKG
25
100
nA
Temperature Accuracy
TEMPACC VCC or VBAT = +3.3V
Q
3
N
C
Temperature Conversion Time
tCONV
10
ms
Pushbutton Debounce
PBDB
250
ms
Reset Active Time
tRST
250
ms
Oscillator Stop Flag (OSF) Delay
tOSF
(Note 3)
125
200
ms
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Active Battery Current
(I2C Active) (Note 4)
IBATA
VBAT = +3.63V
70
A
VBAT = VBATMAX
150
Timekeeping Battery Current
(I2C Inactive) (Note 4)
IBATT
VBAT = +3.63V, EN32KHZ = 0
2
3.0
A
VBAT = VBATMAX, EN32KHZ = 0
2
3.5
Temperature Conversion Current
(I2C Inactive)
IBATTC
VBAT = +3.63V
575
A
VBAT = VBATMAX
650
Data Retention Current
(Oscillator Stopped and I2C
Inactive)
IBATDR
TA = +25NC
100
nA
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC Fall Time, VPFMAX to
VPFMIN
tVCCF
300
F
s
VCC Rise Time, VPFMIN to
VPFMAX
tVCCR
0
F
s
Recovery at Power-Up
tREC
(Note 5)
250
300
ms
相关PDF资料
DS3231SN#T&R IC RTC W/TCXO 16-SOIC
DS3232MZ+ IC RTC W/SRAM I2C 8SOIC
DS3232SN#T&R IC RTC W/TCXO 20-SOIC
DS3234S# IC RTC W/TCXO 20-SOIC
DS32C35-33#T&R IC RTC ACCURATE I2C 3.3V 20-SOIC
DS3911T+ IC DAC 10BIT I2C QUAD 14TDFN
DS4000KI/WBGA IC OSC TCXO 19.44MHZ 24-BGA
DS4026S+WCN IC OSC TCXO 25MHZ 16-SOIC
相关代理商/技术参数
DS3231MZ+TRL 功能描述:实时时钟 5+/-ppm RTC RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
DS3231MZEVKIT# 功能描述:时钟和定时器开发工具 Evaluation kit for t he +/-5ppm, I2C Real RoHS:否 制造商:Texas Instruments 产品:Evaluation Modules 类型:Clock Conditioners 工具用于评估:LMK04100B 频率:122.8 MHz 工作电源电压:3.3 V
DS3231N/DIP 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS3231S 功能描述:实时时钟 Integrated RTC/TCXO/Crystal RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
DS3231S- 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Extremely Accurate I2C-Integrated
DS3231S# 功能描述:实时时钟 Integrated RTC/TCXO/Crystal RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube
DS3231S#T&R 制造商:Maxim Integrated Products 功能描述:REAL TIME CLOCK SERL 16SOIC W - Tape and Reel 制造商:Maxim Integrated Products 功能描述:REAL TIME CLOCK SERL 16SOIC W - Cut TR (SOS) 制造商:Maxim Integrated Products 功能描述:IC RTC W/TCXO 16-SOIC 制造商:Maxim Integrated Products 功能描述:Real Time Clock Integrated RTC/TCXO/Crystal
DS3231S#T&R 功能描述:实时时钟 Integrated RTC/TCXO/Crystal RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube